ʻO nā kiola nui a menā kalaiwahe kuleana koʻikoʻi i ka hana ʻana i ka mīkini, ka hana kaʻa, ka hana moku, ka mana mana, ka ʻoihana mea kaua, ka hana hao a me ke kila a me nā māla ʻē aʻe. E like me nā ʻāpana koʻikoʻi, loaʻa iā lākou ka nui a me ke kaumaha, a paʻakikī kā lākou ʻenehana a me kā lākou hana. ʻO ke kaʻina hana maʻamau ma hope o ka hoʻoheheʻe ʻana i ka ingot,ke kalaiwa anaa i ʻole ka hoʻoheheʻe hou ʻana, ma o ka mīkini hoʻomehana kiʻekiʻe e kiʻi i ka nui o ke ʻano i koi ʻia a me nā koi ʻenehana, e hoʻokō i nā pono o kāna kūlana lawelawe. Ma muli o kāna mau ʻano ʻenehana hana, aia kekahi mau mākau noi no ka ʻike kīnā ʻole o ka hoʻolei ʻana a me ka forging ʻāpana.
I. Ultrasonic inspection o ka hoolei ana
Ma muli o ka nui o ka palaoa, ka maikaʻi ʻole o ka leo a me ka haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa o ka hoʻolei ʻana, he paʻakikī ke ʻike i nā hemahema ma ka hoʻohana ʻana i ke kani kani me ka ikehu kani alapine kiʻekiʻe i ka hoʻolaha ʻana o ka hoʻolei ʻana, i ka wā e hālāwai ai me ka kūloko. ʻili a i ʻole ke kīnā, loaʻa ka hemahema. ʻO ka nui o ka ikehu kani i hōʻike ʻia he hana ia o ke kuhikuhi a me nā waiwai o ka ʻili o loko a i ʻole ka hemahema a me ka impedance acoustic o ia kino reflective. No laila, hiki ke hoʻohana ʻia ka ikehu kani i ʻike ʻia o nā hemahema a i ʻole nā ​​​​ʻili o loko e ʻike i kahi o nā hemahema, ka mānoanoa o ka paia a i ʻole ka hohonu o nā hemahema ma lalo o ka ʻili. Kani ultrasonic ho'āʻo e like me ka nui hoʻohana nondestructive ho'āʻo 'ano, kona mau pomaikai nui: kiʻekiʻe detection sensitivity, hiki ke ike i ka maikai māwae; Loaʻa i ka mana komo nui, hiki ke ʻike i nā castings ʻāpana mānoanoa. ʻO kāna mau palena nui penei: paʻakikī ka wehewehe ʻana i ke ʻano nalu i ʻike ʻia o ke kīnā ʻole me ka nui o ka contour paʻakikī a me ke kuhikuhi pololei ʻole; ʻO nā hale i makemake ʻole ʻia, e like me ka nui o ka palaoa, microstructure, porosity, inclusion content or fine dispersed precipitates, e keakea pū i ka wehewehe ʻana i ka nalu. Eia kekahi, pono ke kuhikuhi ʻana i nā poloka hoʻāʻo maʻamau.

2.forging kani ultrasonic nānā
(1)Ka hana ʻana i ka hana ʻanaa me nā hemahema maʻamau
Hoʻopaʻaua hanaia me ka wela kila ingot deformed eke kalaiwa ana. ʻO kakaʻina forgingʻo ka hoʻomehana ʻana, ka deformation a me ke anuanu.Hoʻopaʻahiki ke hoʻokaʻawale ʻia nā hemahema i nā hemahema hoʻolei,hana hewaa me nā hemahema mālama wela. ʻO nā hemahema o ka hoʻolei ʻana, ʻo ia ke koena o ka shrinkage, wehe, hoʻokomo, māwae a pēlā aku.Ke kuhi hewaʻo ka hapa nui o ka pelu ʻana, kahi keʻokeʻo, māwae a pēlā aku. ʻO ka hemahema nui o ka mālama ʻana i ka wela ka māwae.
ʻO ke koena o ka puʻu shrinkage ka lua shrinkage i loko o ka ingot i ka forging i ka wā ʻaʻole lawa ke poʻo e noho ai, ʻoi aku ka maʻamau i ka hopena o ka forgings.
Loose ka ingot solidification shrinkage i hoʻokumu ʻia i loko o ka ingot ʻaʻole paʻa a me nā lua, forging ma muli o ka nele o ka forging ratio a ʻaʻole i hoʻoheheʻe piha ʻia, ka mea nui ma ke kikowaena ingot a me ke poʻo. e
Loaʻa ka hoʻokomo i ka hoʻokomo i loko, ka hoʻokomoʻole i waho a me ka hoʻokomo metala. Hoʻopili nui ʻia nā mea i loko i ke kikowaena a me ke poʻo o ka ingot.
Aia nā māwae i nā māwae hoʻolei, nā māwae forging a me nā māwae mālama wela. Hoʻokumu ʻia nā māwae intergranular i ke kila austenitic ma ka hoʻolei ʻana. ʻO ka hoʻopololei kūpono ʻole a me ka mālama ʻana i ka wela e hana ʻia nā māwae ma ka ʻili a i ʻole ke kumu o ka hana ʻana.
ʻO ke kiko keʻokeʻo ke kiʻekiʻe o ka hydrogen maʻiʻo o ka forgings, ʻoi aku ka wikiwiki ma hope o ka hoʻoheheʻe ʻana, ʻo ka hydrogen i hoʻoheheʻe ʻia i loko o ke kila ua lohi loa e pakele, e hopena i ka haki ʻana ma muli o ke kaumaha nui. Hoʻopili nui ʻia nā kiko keʻokeʻo i waenakonu o ka ʻāpana nui o ka forging. Hōʻike mau nā kiko keʻokeʻo i loko o nā pūpū i ke kila. * x- H9 [:
(2) Nānā i nā ʻano hana ʻike hala
E like me ka hoʻokaʻawale ʻana o ka manawa ʻike kīnā, hiki ke hoʻokaʻawale ʻia ka ʻike ʻana i ka hewa i ka ʻike kīnā ʻole a me ke kaʻina hana, ka nānā ʻana i nā huahana a me ka nānā ʻana i ka lawelawe.
ʻO ke kumu o ka ʻike ʻana i nā hemahema i nā mea maka a me nā kaʻina hana, ʻo ia ka ʻimi mua ʻana i nā hemahema i hiki ke hana ʻia nā hana i ka manawa e pale aku ai i ka hoʻomohala ʻana a me ka hoʻonui ʻana i nā hemahema i hopena i ka ʻōpala. ʻO ke kumu o ka nānā ʻana i ka huahana e hōʻoia i ka maikaʻi o ka huahana. ʻO ke kumu o ka nānā ʻana i loko o ka lawelawe ʻo ia ka nānā ʻana i nā hemahema i hiki mai a ulu paha ma hope o ka hana ʻana, ʻoi aku ka nui o nā māwae luhi. + 1. ʻO ka nānā ʻana i nā kumu hoʻoheheʻe
Hoʻokumu nui ʻia ke kaʻina hana forging o shaft forgings ma ke kaha kiʻi, no laila ua like ke ʻano o ka hapa nui o nā hemahema me ke axis. ʻOi aku ka maikaʻi o ka ʻike ʻana o ia mau hemahema ma o ka ʻimi pololei ʻana o ka nalu longitudinal mai ka ʻaoʻao radial. Ke noʻonoʻo nei e loaʻa i nā hemahema ka mahele ʻē aʻe a me ka hoʻonohonoho ʻana, no laila, pono e hoʻohui ʻia ka lāʻau forging flaw detection e ka ʻimi pololei axial detection a me oblique probe circumferential detection a me axial detection.
2. Ka nānā 'ana i ka keke a me nā kīʻaha kīʻaha
ʻO ke kaʻina hana hoʻoheheʻe ʻana i nā keke a me nā kīʻaha kīʻaha he mea nui loa ia, a ʻo ka māhele ʻana o nā hemahema e like me ka maka hope, no laila ʻo ia ke ala maikaʻi loa e ʻike ai i nā hemahema ma ka ʻimi pololei ma ka maka hope.
3. Ka nānā 'ana i nā mea hoʻoheheʻe cylinder
ʻO ke kaʻina hana forging o ka cylinder forgings he mea hoʻonāukiuki, kuʻi a ʻōwili. No laila, ʻoi aku ka paʻakikī o ka hoʻonohonoho ʻana o nā hemahema ma mua o ke kumu o ka shaft a me ka forgings keke. Akā, no ka mea, ua wehe ʻia ke kikowaena o ka ingot maikaʻi loa i ka wā e kuʻi ai, ʻoi aku ka maikaʻi o ka hoʻoheheʻe cylinder. ʻO ke kumu nui o nā hemahema e like nō ia me ka ʻili o ka cylindrical ma waho o ka cylinder, no laila ke ʻike nui ʻia nā forgings cylindrical e ka probe pololei, akā no nā forgings cylindrical me nā paia mānoanoa, pono e hoʻohui ʻia ka ʻimi oblique.
(3) Ke koho ʻana i nā kūlana ʻike
Koho ʻimi
Hoʻopaʻaka nānā 'ana i ke kani ultrasonic, ka ho'ohana nui 'ana o ka hawewe longitudinal pololei probe, ka nui wafer o φ 14 ~ φ 28mm, ho'ohana mau 'ia φ 20mm. No ka meamau kalai liilii, hoʻohana maʻamau ka ʻimi chip e noʻonoʻo ana i ke kahua kokoke a me ka nalowale hoʻohui. I kekahi manawa no ka ʻike ʻana i nā hemahema me kahi Angle o ka ʻili ʻike, hiki ke hoʻohana i kekahi waiwai K o ka ʻimi inclined no ka ʻike. Ma muli o ka mana o ka ʻāpana makapō a me kahi kokoke i ke kula o ka ʻimi pololei, hoʻohana pinepine ʻia ka ʻimi pololei ʻelua e ʻike i nā hemahema kokoke.
ʻOi aku ka liʻiliʻi o nā kīʻaha o ka forgings, no laila hiki ke koho ʻia ke alapine ʻike flaw kiʻekiʻe, maʻamau 2.5 ~ 5.0mhz. No kekahi mau forgings me ka nui o ka palaoa a me ka attenuation koʻikoʻi, i mea e pale aku ai i ka "forest echo" a hoʻomaikaʻi i ka ratio signal-to-noise, pono e koho ʻia kahi alapine haʻahaʻa, maʻamau 1.0 ~ 2.5mhz.